Quantum Chips: Enabling Technologies
HORIZON-JU-CHIPS-2026-QUANTUM-2-RIA
Expected outcomes
- Platform-agnostic usability of enabling subsystems across ≥2 quantum platforms, with documented interfaces to foundries or pilot lines.
- Miniaturisation and subsystem assembling enabling higher-scale quantum systems via co-packaging, heterogeneous integration or monolithic integration
- Manufacturability and reliability gains, evidenced via pilot-line runs/MPWs, test reports and BoMs.
- Strengthened European supply capability and reduced dependency on non-EU sources for critical parts, through EU-based components and supply agreements.
- Compatibility with microelectronics infrastructure, New paradigms enabling low[1]power and low-size enabling technologies (e.g. control and readout electronics), up to monolithic integration if/where possible
Budget; 20 M€
Open date: 07 Jul 2026
Deadline 17 Sep 2026 at 17:00 BXL time
More information: GB_2025.125_Appendix8_2026_CEIv1.pdf ( page 44)